Paradigm Shift of ESD Technology in Defence

We need highly efficient Electro-static dissipative surfaces and work areas where these sophisticated electronic components are used.

Defence microelectronics is very demanding in terms of the complexity and density of the microprocessors and high impedance circuitry in the PCG hardware. The constant evolution of warfare tactics led to massive restructuring of radar, telematics, propulsion and many other systems used in varied military and space applications. If compared to their earlier versions, these systems are now more refined, compact and include highly sophisticated electronics. This intricacy and miniaturization of electronic components has made them more susceptible to ESD damage during any phase of manufacturing or testing.

Electro-static accumulated charge, can damage and destroy intricate construction of today’s miniature electronic components and render them useless. Apart from causing varying degrees of inconveniences to the customer, failure of an electronic component in critical applications like telematics of a missile or space shuttle, radar system of a tank or submarine in the field might result in loss of lives. Industry estimates mention 8% to 33% losses as a direct result of Electro-static damage. Thus, non dissipated Electro-static charge, imposes an unacceptably high cost to the bottom-line and addressing these issues is imperative for any defence and space related organization.

Electro-static Prevention and ESD Protection are thus vital to improving reliability and reducing defects in today’s defence electronics manufacturing facility. The good news is that Electro-static prevention and control is easy and sustainable with the advent of new technology that is driving managers to use fail-safe ESD products in their assembly, manufacturing and testing tables and stations.

What is traditional ESD technology?

Products such as ESD matting on workbenches, chairs fabric coated with ESD sprays are presently used in defence areas where semiconductor and PCB assembly and testing is carried out for electronic products to be u